Suitable for handling 4/6, 8/12 inch wafer products.
Loading and unloading methods: Supports FOUP, Open Cassette, and Coin Box
Basic functions: Includes Auto Mapping and Notch Alignment
Optional functions: OCR, Barcode Reader, SCES/GEM.
| project | Specification Description |
|---|---|
| Dimensions | W1440 X D1260 X H2250 |
| Wafer Input / Output | 00mm FOUP 25pcs(SEMI E47.1)、FOSB 25 pcs(SEMI M31) or 300mm FOUP with 8’Open Cassette/SEMI Standard : E47.1, E62 |
| Wafer Size | 200mm-300mm, Thickness0.4-1.0 mm |
| Throughput | 200pcs/H |
| Clean Level | ISO Class2 (FFU) |
| Load Port | 2 Port |
| Weight | 500Kg |
| Utilities | Power ：AC220V 50HZ / Dry air ：0.5MPa±10% / Vacuum： >-53KPa |
