Used for chip sorting and alignment process, meets the requirements for tray & wafer fully automatic chip loading. The product can be picked up from the tray by vision inspection, and then accurately aligned on the glued wafer carrier after visual detection and positioning, and then undergoes subsequent processing.
Chip input compatible with Waffle Pack Tray / Carrier / Magazine .
Chip output compatible with 6-inch/8-inch/12-inch wafers or other carriers.
Wafer open cassette / FOUP load port is available.
The dual pick-and-place heads and flying vision architecture enable high throughput, and the pick-and-place head has four-axis X/Y/Z/θ functionality.
High-precision chip sorting : wafer full range < +/- 50μm, θ +/-1°.
The wafer has a heating pre-curing mechanism, which can be heated uniformly and the temperature is adjustable from 0-200℃.
| project | Specification Description |
|---|---|
| Chip Size | 0.5*0.5mm-3*3mm |
| Chip Thickness | 0.1mm-3mm |
| Carrier Loading/Unloading | Fully automatic loading and unloading (magazine-style feeder) |
| Chip Feeding | Waffle Pack Tray、JEDEC Tray，Carrier |
| Wafer Loading/Unloading | Open Cassette or EFEM Load port |
| Wafer Size | 12 inch（6/8 inch option） |
| Placement Accuracy | X,Y +/- 50μm ，θ+/-1° |
| Curing Heating Temperature | 0-200±3℃ |
| Pick-and-Place Modules | 2 Sets |
