Equipment can be applied to IC chip defect inspection and sorting. It suitable for picking and sorting of various semiconductor chips such as IGBT, sensor, memory chip, laser diode, etc. The process is the chips are picked up from the tray or wafer, performed top side or side-wall inspection and then placed into the dedicated tray.
High flexibility design, can be combined with different chip feeding
Automatic barcode-saning enables intelligent product information management
Tray vision function available, the chip placement accuracy is ≤ +/-30μm, and the angle is ≤ +/-1°
CT: pick-up and placement time of 1.5s + inspection time (depending on the product process)
The chip pick-up and placement adopts force control technology and angle rotation combined with customized suction nozzles, which can stably and quickly perform chip pick-up and placement
| project | Specification Description |
|---|---|
| Placement Accuracy | X/Y ±25μm（3σ,verified based on calibration block），θ±1゜ |
| Cycle Time | 1.5s ( UPH depended on product process and quantity ) |
| Product Size | chip size 1.5x1.5~15x15 mm, chip thickness 0.07~3mm |
| Bond Force | 20~300g |
| Product Loading Methods | Waffle pack Tray (wafer optional) |
| Bond Head Rotation Range | 360° |
| Dimension | 1450(L)x1200(W)x2000(H) mm |
