This equipment is suitable for chip sorting process after wafer dicing. Chips are picked up from wafer by visual identification, positioning, then placed into a dedicated carrier, such as waffle pack tray，tape frame or other carriers.
Suitable for thin and slim chips, such as storage chips (thin chips), driver ICs, MEMS, etc.
Supports 8-12 inch wafer rings or cassettes
Compatible with 2/3/4 inch trays, and can expand the die binning function
Standard Function : chips are picked up from wafer and placed to tray (Wafer to Tray)
Application Function : chips are picked from wafer and placed to frame (Wafer to Frame)
Application Function : chips are picked from tray and placed to frame (Tray to Frame)
| project | Specification Description |
|---|---|
| UPH | <=8K（depending on chip size and pick-and-place process parameters） |
| Chip Thickness | 0.2~0.7mm |
| Chip Size | 0.5x0.5 mm ~ 25x25 mm |
| Placement Accuracy | XY: ± 50μm(3σ)，θ± 1゜ |
| Pick up Force | 60~250g |
| Wafer Size | 12 inch standard（8inch / 6inch optional） |
| Wafer Loading/Unloading | Fully automatic ( 12 inch wafer cassette ) |
| Wafer Mapping | Supports standard wafer map format |
| Wafer Bin Number | 1 bin(standard)、3 bin(option) |
| Tray Loading/Unloading | Fully automatic (tray stacked loader and unloader, 30 pcs.) |
| Tray Size | 2”、3”、4”waffle Pack Tray |
| Weight | 1200kg |
