Suitable for IC assembly and sputtering process and is designed for tape mounting of 12 inch and smaller wafer frame or square frames.
Supports feeding of UV tape, blue tape, or roll film with release tape
Compatible with magazine or cassette feeding of wafer frames
Adjustable feeding track width for greater flexibility
Tape mounting motion programable
Tension of tape can be adjusted as per requirement
Automatic cutting tape after mounting with adjustable front and back knife position
Supports 180°flipping after tape mounting
| project | Specification Description |
|---|---|
| UPH | >90pcs |
| Tape Mounting Accuracy | ±0.2mm |
| Tape Mounting Accuracy | Vacuum Nozzle |
| Tape Frame Size | Maximum 12 inch frame or 240x215mm square frame |
| Changeover | 15-20mins |
| Frame flip function (after mounting) | 180° |
