Suitable for IC assembly and sputtering process for the products such as Package, QFN, BGA, and LGA, It can improve the bonding effect between the product and the adhesive film before sputtering, preventing adhesive overflow from gaps between the film and the product.
The high resolution camera scans the products, the data of products and the frame can be uploaded to the system.
Integrated MES function for product scanning and information management
The travel of press is controllable with precision of ±0.01mm
Pressure is controllable with a high-precision pressure sensor with accuracy of ±0.5kg
Press time can be adjusted according to the different requirements of products
| project | Specification Description |
|---|---|
| Press Force | 0kg-200kg |
| Press Time | 0s-200s |
| Flatness of Press Stage | platform within 100μm in the effective compression area |
| Changeover | 15-20mins |
| Maximum Press Size | 250*250mm |
| Scanning Accuracy | >99.99% |
