For 3/4 inch thin wafers (min. thickness 60~100 μm). This allows for precise alignment calibration
♦The process supports automatic loading into trays and coin boxes via SECS and local recipe commands respectively
♦Packaging includes wafers, trays, foam pads, and discs as buffering materials
♦Content identification involves reading
♦Cassette ID: One-dimensional/two-dimensional code
♦Wafer ID: OCR
♦Cleanroom level: Class 100
♦UPH < 500 (calculation condition: 2 foam pads, 12 wafers, 1 spacer disc)
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