Wafer Auto Packing Machine
Model : CYG-WPM34
Equipment Overview

For 3/4 inch thin wafers (min. thickness 60~100 μm). This allows for precise alignment calibration


Equipment characteristics

♦The process supports automatic loading into trays and coin boxes via SECS and local recipe commands respectively

♦Packaging includes wafers, trays, foam pads, and discs as buffering materials

♦Content identification involves reading

♦Cassette ID: One-dimensional/two-dimensional code

♦Wafer ID: OCR

♦Cleanroom level: Class 100

♦UPH < 500 (calculation condition: 2 foam pads, 12 wafers, 1 spacer disc)

Technical Parameter
project Specification Description