Suitable for such as IGBT, sensor, memory chip, laser diode and other IC chip bonding processes. Dual-liner motor driving gantry structure with multi-head and flying vision for the mounting process for different chips, solder pieces, graphite frames, substrate, DBC, fixtures, and other devices.
Flexible system can be with various feeding modules such as chips, solder sheets, metal frames, devices, substrate tooling, … etc.
Compatible with 6-inch/8-inch/12-inch wafer feeding, various solder chip feeding Modules
Automatic barcode-saning enables intelligent product information management.
Modular design can quickly changeover with different products and process for customized services
Modular mechanical interface can be flexibly configured and applied in a single machine or in series
Modular design, easy to operate and maintain, cost effective
Bonding Accuracy : +/-10μm
project | Specification Description |
---|---|
Mounting Method | Solder preform, Solder paste |
Placement Accuracy | X/Y ±10μm(3σ、based on calibration block verification accuracy) |
Cycle Time | 1s(pickup and placement time), UPH depends on product process |
Material Size | Chip size 2x2~20x20mm,chip thickness>0.05 DBC size : 30~50mm(W),thickness 0.9~1.2mm |
Bond Force | 30~300g |
Solder Film Cutting Accuracy | ±0.1mm |
Wafer Size | 6~12 inch |
Product Loading Function | Wafer Frame、Waffle Pack Tray、vibrating feeder、parts feeder、Metal Frame 、Magazine… etc. |
Available Materials | FRD、IGBT chip、NTC、Solder Film、Metal Frame 、DBC、Carrier、Space… etc. |
Carrier size | Rail width adjustable : 85mm ~ 332mm |
Bonding Head Rotation Angle | 360° |
Pick up Nozzle | Auto-change, 12 sets different type |
Ejector | Auto-change, 4 sets different type |
Others | Optional modules include glue dispensing module, scanning module (including wafer, DBC, fixtures, tape) |
Dimension | 1200x1500x2200 mm(excluding the protruding part of the equipment body) 2000x1900x2200 mm (including the protruding part of the front and rear docking tracks and basket lifting table) |